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Reflow oven Product List

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Tabletop Reflow Oven (Heating Furnace) SVO-1 Plus

Tabletop Reflow Oven (Heating Furnace) SVO-1 Plus

Top and bottom heating, supports heating up to 400℃, tabletop reflow furnace (heating furnace).

The SVO-1 Plus is a tabletop reflow oven newly added to the lineup as a higher model of the SVO-1, aimed at further improving heating speed and temperature uniformity. Heaters are arranged above and below the oven, and the output of each heater can be individually set. By optimizing the heating temperature settings and heater output suitable for the target workpieces, it is possible to shorten cycle times and improve the uniformity of workpiece temperatures. In addition to its use for reflow soldering, it can also operate for long periods at a constant temperature, making it suitable for applications such as board drying and thermal curing. 【Features】 ■ Supports heating from above and below the board ■ Individual setting of each heater output ■ Supports heating up to 400°C ■ Temperature profile settings for up to 8 zones ■ Continuous operation at a constant temperature for up to 10 hours *For more details, please download the PDF or contact us.

  • Reflow Equipment

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Tabletop Conveyor Reflow Oven SVO-340C

Tabletop Conveyor Reflow Oven SVO-340C

Compact tabletop conveyor reflow oven compatible with heating up to 400℃.

This is a space-saving tabletop reflow oven (heating furnace) using infrared heaters. It can be used not only for reflow soldering but also for low-speed operation at a constant temperature, making it suitable for applications such as drying circuit boards and thermosetting bonding agents.

  • Heating device

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Tabletop reflow oven (heating furnace) SVO-1

Tabletop reflow oven (heating furnace) SVO-1

Tabletop reflow furnace (heating furnace) compatible with heating up to 400℃.

This is a tabletop heating furnace capable of heating printed circuit boards and flat workpieces up to 250x330mm as standard. The heating temperature profile can be set for up to 8 zones. It can be used not only for reflow soldering but also for long-term operation at a constant temperature, making it suitable for applications such as drying circuit boards, thermal curing of underfill materials, and die bonding pastes.

  • Reflow Equipment

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Vacuum and Pressure Reflow Furnace 'VPF300'

Vacuum and Pressure Reflow Furnace 'VPF300'

With technical data included, significantly reduces void ratio under a maximum pressure of 0.4 MPa. Improves process efficiency with rapid cooling. Compatible with fluxless soldering.

The VPF300 is a vacuum and pressure reflow oven that not only creates a vacuum (reduced pressure) inside the chamber but can also apply pressure up to 0.4 MPa, significantly reducing the void rate inside the solder and achieving high-quality soldering. Process conditions such as chamber pressure and heating temperature can be set for each workpiece, and efficient heating and cooling are possible thanks to its unique rapid cooling function. Additionally, it supports formic acid reduction reflow and forming gas reflow, allowing for the establishment of a flux-free soldering process. The 2023 model has improved the cooling mechanism, enhancing maintainability. 【Features】 ■ A wide effective heating area of 300×300 mm ■ Maximum heating temperature of 450℃ ■ The vacuum chamber is equipped with an observation window ■ Features an intuitive touch panel GUI for easy operation *Product documentation can be viewed via "PDF Download." Please feel free to contact us if you wish to request a test.

  • Reflow Equipment
  • Soldering Equipment

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Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Vacuum Reflow Oven [Desktop Type, Compatible with Formic Acid Reduction Process]

Heating settings up to 450℃, compatible with formic acid reduction processes, standard equipped with substrate cooling function.

This is a tabletop vacuum reflow oven that significantly reduces voids inside solder by changing the pressure within the process chamber, enabling high-quality voidless soldering. The heating area measures 200mm x 200mm x height 50mm and supports heating from both above and below. The pressure can be set arbitrarily within the range of atmospheric pressure to 10Pa, allowing for flexible adjustment of pressure and heating profiles according to the target workpiece. By using an optional formic acid bubbler unit with a heat retention function, it generates a stable concentration of a mixed gas of formic acid and nitrogen, removing the oxide film from the workpiece through a reduction reaction, and it can also accommodate a fluxless soldering process that does not use flux.

  • Soldering Equipment
  • Reflow Equipment

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